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  • J.-C. Barbé CEA-Leti France
    D. Esseni University of Udine Italy
    F. Gamiz University of Granada Spain
    Y. Kamakura Osaka Institute of Technology Japan
    N. Mori Osaka University Japan
    L. F. Register University of Texas at Austin USA
    K. Sonoda Renesas Japan
    W. G. Vandenberghe University of Dallas USA
    E. M. Bazizi Applied Materials USA
    R. Dutton Stanford University USA
    S. Selberherr TU Wien Austria
    K. Taniguch Osaka University Japan
    R. Dutton Stanford University USA
    S. Selberherr TU Wien Austria
    K. Taniguchi Osaka University Japan
    J.-C. Barbé CEA-Leti Chair
    D. Rideau ST co-chair
    S. Martinie CEA-Leti TPC chair
    B. Rae ST TPC co-chair
    P. Blaise SILVACO tuto. & work. chair
    F. Triozon CEA-Leti tuto. & work. Co-chair
    S. Barbier CEA-Leti local org.
    O. Rozeau CEA-Leti treasurer
    T. Poiroux CEA-Leti IEEE reletion
    A. Cathelin ST Advisor
    F. Boeuf ST Advisor
    B. Lisei ST Facilitators
    D. Maître ST Proceeding manager
    J. Berthet Co-local org.
    J-C. Barbe CEA-Leti
    E. M. Bazizi Applied Materials
    B. Obradovic Intel
    D. Esseni Univ. of Udine
    L. Filipovic TU Vienna
    F. Gamiz Univ. of Granada
    V. Georgiev Glasgow Univ.
    E. Guichard Silvaco
    M. Houssa Ku Leuven
    F. Jazaeri EPFL
    Y. Kamakura Osaka Institute of Technology
    M. Karner Global TCAD Solutions
    Y-S. Kim Samsung
    KT. Lam TSMC
    D. Lizzit Univ. of Udine
    M. Luisier ETH Zurich
    H. Minari Sony
    N. Mori Osaka University
    V. Moroz Synopsys Inc.
    L. F. Register UT Austin
    D. Rideau STMicroelectronics
    K. Sonoda Renesas 
    S. Souma Kobe Univ.
    H. Tanaka Osaka Univ.
    W. Vandenberghe UT Dallas

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